flip-chip bump

См. также в других словарях:

• flip-chip bump — gūburinis apverstojo lusto išvadas statusas T sritis radioelektronika atitikmenys: angl. flip chip bump vok. Flip Chip Höcker, m rus. столбиковый вывод перевёрнутого кристалла ИС, m pranc. poutre de cristal inverse, f; poutre de flip chip, f …   Radioelektronikos terminų žodynas

• Flip-Chip-Höcker — gūburinis apverstojo lusto išvadas statusas T sritis radioelektronika atitikmenys: angl. flip chip bump vok. Flip Chip Höcker, m rus. столбиковый вывод перевёрнутого кристалла ИС, m pranc. poutre de cristal inverse, f; poutre de flip chip, f …   Radioelektronikos terminų žodynas

• Flip chip — Flip chip, also known as Controlled Collapse Chip Connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and MEMS, to external circuitry with solder bumps that have been deposited onto the chip pads …   Wikipedia

• poutre de flip-chip — gūburinis apverstojo lusto išvadas statusas T sritis radioelektronika atitikmenys: angl. flip chip bump vok. Flip Chip Höcker, m rus. столбиковый вывод перевёрнутого кристалла ИС, m pranc. poutre de cristal inverse, f; poutre de flip chip, f …   Radioelektronikos terminų žodynas

• Chip carrier — A standard sized 8 pin dual in line package (DIP) containing a 555 timer IC. A chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or… …   Wikipedia

• Thermal copper pillar bump — The Thermal Copper Pillar Bump, also known as the thermal bump , is a thermoelectric device made from thin film thermoelectric material embedded in flip chip interconnects (in particular copper pillar solder bumps) for use in electronics and… …   Wikipedia

• gūburinis apverstojo lusto išvadas — statusas T sritis radioelektronika atitikmenys: angl. flip chip bump vok. Flip Chip Höcker, m rus. столбиковый вывод перевёрнутого кристалла ИС, m pranc. poutre de cristal inverse, f; poutre de flip chip, f …   Radioelektronikos terminų žodynas

• poutre de cristal inverse — gūburinis apverstojo lusto išvadas statusas T sritis radioelektronika atitikmenys: angl. flip chip bump vok. Flip Chip Höcker, m rus. столбиковый вывод перевёрнутого кристалла ИС, m pranc. poutre de cristal inverse, f; poutre de flip chip, f …   Radioelektronikos terminų žodynas

• столбиковый вывод перевёрнутого кристалла ИС — gūburinis apverstojo lusto išvadas statusas T sritis radioelektronika atitikmenys: angl. flip chip bump vok. Flip Chip Höcker, m rus. столбиковый вывод перевёрнутого кристалла ИС, m pranc. poutre de cristal inverse, f; poutre de flip chip, f …   Radioelektronikos terminų žodynas

• Ultratech, Inc. — Ultratech, Inc. nasdaq|UTEK is a publicly traded international technology company based in San Jose, California which supplies equipment to global semiconductor fabs and foundries, and also makes industry leading tools for nanotechnology… …   Wikipedia

• Integrated circuit — Silicon chip redirects here. For the electronics magazine, see Silicon Chip. Integrated circuit from an EPROM memory microchip showing the memory blocks, the supporting circuitry and the fine silver wires which connect the integrated circuit die… …   Wikipedia